عنوان

Bridging the Gap Between Technological Advancement and Manufacturability:

Number

TL0j412659

.Language of Text, Soundtrack etc

انگلیسی

Title Proper

Bridging the Gap Between Technological Advancement and Manufacturability:

General Material Designation

[Thesis]

First Statement of Responsibility

Kim, Yun Soung

Title Proper by Another Author

Development of Solderable Stretchable Sensing Systems

Subsequent Statement of Responsibility

Coleman, Todd P.

Date of Publication, Distribution, etc.

2017

Body granting the degree

Coleman, Todd P.

Text preceding or following the note

2017

Text of Note

In the past decade, development of stretchable, thin-lm electronics have garnered attention from healthcare industries to general public, since such platform would enable a direct integration with skin, providing the means of intimate and unobtrusive health monitoring. However, such transition of the technology to consumers has been hampered by challenges associated with high-cost, inability to scale, and low device reliability. To address this, we see an increase in researcheort in adopting the use of rigid, yet small, commercial-off-the-shelf chip components. The value gained by employing the full sophistication of modern integrated circuits (ICs) is disproportionate to the slight loss in overall stretchability. This dissertation aims to provide a unique methodology that weds the bene ts of both thin-lm and surface mount technologies. However, the focus is not only on developing the new sophisticated systems but also on scalability of the manufacturing process. First, we introduce a method to produce a stretchable, thin-lm interconnection platform exhibiting an excellent solderability with industry-standard SAC (Sn96.5/Ag3.0/Cu0.5) solder alloy. This platform, which we call Solderable and Stretchable Sensing System (S4), was further veried for its feasibility to be scalably manufactured through the demonstrative production of S4 respiration sensing devices. Finally, we demonstrated the direct integration of fully assembled S4 devices with a large area adhesive lm, proving the methods compatibility with a roll-to-roll process. Next we explored S4s capacity as a platform for wireless communication devices involving high frequency radio signals, such as those involved with Bluetooth protocols. We introduced the engineering challenges found in designing thin-lm conductive traces for reliably accommodating radio frequency RX/TX. As a solution to these challenges, S4s utilized novel stretchable antennas boasting similar thin-lm conductive properties, obviating chip antennas and further demonstrating their versatility as an electronic platform. Finally, we employed S4 devices capable of physiological monitoring, signal amplication, analog-to-digital conversion, andwireless communication via Bluetooth Low Energy protocols using the integrated stretchable antennas. We demonstrated S4s capacity for adopting various surface mount chip packages, scalable manufacturing and packaging, support for high frequency digital signals, and transmitting/receiving wireless radio signals. We believe the compatibility of the manufacturing methods with existing tools and materials, as well as S4s versatile and modular characteristics successfully tie together the values of stretchable electronics and advanced IC technologies.

van den Berg, Dillon Norris

Kim, Yun Soung

UC San Diego

Electronic name

p

[Thesis]

276903

a

Y