TY  - BOOK
A1  - Sponsored by the Electrical and Electronic packaging Division, ASME, The Japan Society of Mechanical Engineers; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
TI  - Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack  95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Luhaina, Maui, Hawaii
PB  - کتابخانه مرکزی دانشگاه صنعتی امیرکبیر
SN  - 91704093
UR  /book/91704093/Advances-in-electronic-packaging-1995-proceedin/
ER  -