@BOOK{ Book!D - 91702347,
AUTHOR = "sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[",
TITLE = "Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia",
LIBRARY= "کتابخانه مرکزی دانشگاه صنعتی امیرکبیر",
SUBJECT = " Electronic packaging - Materials - Congresses  , Materials - Electric properties - Congresses  ",
URL = "/book/91702347/Application-of-fracture-mechanics-in-electronic-pa/"}