TY  - BOOK
A1  - sponsored by the Manufacturing Engineering Division, ASME, The Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
TI  - Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
PB  - کتابخانه مرکزی دانشگاه صنعتی امیرکبیر
SN  - 91702346
UR  /book/91702346/Sensors-in-electronic-packaging-presented-at-the/
ER  -