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عنوان
Plasma Charging Damage

پدید آورنده
by Kin P. Cheung.

موضوع
Electronics.,Engineering.,Machinery.,Optical materials.,Surfaces (Physics).

رده

کتابخانه
Center and Library of Islamic Studies in European Languages

محل استقرار
استان: Qom ـ شهر: Qom

Center and Library of Islamic Studies in European Languages

تماس با کتابخانه : 32910706-025

INTERNATIONAL STANDARD BOOK NUMBER

(Number (ISBN
9781447102472
(Number (ISBN
9781447110620

NATIONAL BIBLIOGRAPHY NUMBER

Number
b402419

TITLE AND STATEMENT OF RESPONSIBILITY

Title Proper
Plasma Charging Damage
General Material Designation
[Book]
First Statement of Responsibility
by Kin P. Cheung.

.PUBLICATION, DISTRIBUTION, ETC

Place of Publication, Distribution, etc.
London :
Name of Publisher, Distributor, etc.
Imprint: Springer,
Date of Publication, Distribution, etc.
2001.

CONTENTS NOTE

Text of Note
1. Thin Gate-oxide Wear-out and Breakdown -- 2. Mechanism of Plasma Charging Damage I -- 3. Mechanism of Plasma Charging Damage II -- 4. Mechanism of Plasma Charging Damage III -- 5. Charging Damage Measurement I - Determination of Plasma's Ability to Cause Damage -- 6. Charging Damage Measurement II - Direct Measurement of Damage -- 7. Coping with Plasma Charging Damage.
0

SUMMARY OR ABSTRACT

Text of Note
This book provides an in-depth, comprehensive and up-to-date coverage of the subject of plasma charging damage in modern VLSI circuit manufacturing. It is written for beginners as well as practitioners. For beginners, this book presents an easy-to-follow, unified explanation of various charging-damage phenomena, the goal being to provide them with a solid foundation for taking on real damage problems encountered in VLSI manufacturing. For practitioners, it can help bridge the gap between disciplines by providing all of the necessary background materials in one place. Drawing on the author's wide range of experience in plasma science, processing technologies, device physics and reliability physics, the text includes information on: - plasma and mechanisms of plasma damage; - wear-out and breakdown of thin gate-oxides; - the impact of processing equipment on damage; - methods of damage measurement; - damage management; - gate-oxide scaling.

OTHER EDITION IN ANOTHER MEDIUM

International Standard Book Number
9781447110620

PIECE

Title
Springer eBooks

TOPICAL NAME USED AS SUBJECT

Electronics.
Engineering.
Machinery.
Optical materials.
Surfaces (Physics).

PERSONAL NAME - PRIMARY RESPONSIBILITY

Cheung, Kin P.

CORPORATE BODY NAME - ALTERNATIVE RESPONSIBILITY

SpringerLink (Online service)

ORIGINATING SOURCE

Date of Transaction
20190307161000.0

ELECTRONIC LOCATION AND ACCESS

Electronic name
 مطالعه متن کتاب 

[Book]

Y

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